Conference presentations (public)

Presenter

Title

Conference

Janusz Bogdanowicz

In-line resistance measurement of single nanometer-wide trenches and fins

Electrochemical society PRiME meeting 2016 (presentation)

Supriya Surana

Influence of the film morphology and orientation on the depth profiling of perovskite layers

SIMS europe 2016 poster

Alexis Franquet

IN-SITU TOF-SIMS AND SFM MEASUREMENTS OF INORGANIC SEMICONDUCTOR MATERIALS

SIMS europe 2016 poster

Valentina Spampinato

Argon cluster as primary ion source for surface spectrometry of organics.

SIMS europe 2016 poster

W. Vandervorst

Challenges and solutions for confined volume characterisation in semiconductor systems

AVS-63 invited presentation

Janusz Bogdanowicz

Dopant activation in planar and confined volumes
as probed through in-line Sheet resistance measurements

PTW Imec (presentation)

Janusz Bogdanowicz

Size-dependent resistivity in narrow fins
as probed with micro-four-point probe

FCMN presentation

Janusz Bogdanowicz

Sheet-Resistance Measurements 
in Nanometer-Wide Conductive Lines

EMRS presentation

Janusz Bogdanowicz

Sheet Resistance and Mobility Measurements
with Micro-Probes:
from Planar to 3D Technologies

3dam/metro4-3d workshop (poster)

Sebastian Brand

Acoustic GHz-Microscopy, a non-destructive method for metrology in future microelectronic technologies

3dam/metro4-3d workshop (poster)

Valentina Spampinato

A combined SPM/TOFSIMS tool to obtain real chemical 3D information

SIMS XXI (poster)

Ewald Niehuis

3D Chemical Analysis of Inorganic and Organic Nanostructures using TOF-SIMS and In-situ SPM

79th. IUVSTA Workshop

Olivier Scholder

A python library for advanced data analysis of ToF-SIMS and SPM data

SIMS XXI (poster)

Olivier Scholder

The route towards nm-scale resolution with a combination of ToF-SIMS and Scanning Probe Microscopy

SIMS XXI (presentation)

Alexis Franquet

Self Focusing SIMS: a new metrology for the analysis of confined volumes

SIMS XXI (presentation)

Alexis Franquet

ToF-SIMS – SPM combined analysis for real 3D depth profiling of heterogeneous microelectronic structures

SIMS XXI (poster)

Olivier Scholder

Signal-to-Noise ratio enhancement of ToF-SIMS images in combination with AFM measurement

SIMS europe 2018 conference (presentation)

Valentina Spampinato

Actual 3D analysis of hybrid arrays with in-situ SPM in a combined TOF-SIMS/SPM tool

SIMS europe 2018 conference (presentation)

Alexis Franquet

Advanced semiconducting structure analysis with Self-Focusing SIMS and improved mass resolution in a Hybrid-SIMS instrument

SIMS europe 2018 conference (presentation)

Alexis Franquet

Real 3D depth profiling of heterogeneous microelectronic structures using a combined ToF-SIMS/in-situ SPM tool

SIMS europe 2018 conference (poster)

Yan Busby

Depth profiling intrinsically hybrid layers and organic/inorganic stacks by variable-size argon clusters: a ToF-SIMS and XPS study.

SIMS europe 2018 conference (presentation)

R. Brunner

Advanced Ultrasund Characterization in Microelectronics

Ultrasonics 2018 (oral presentation)

R. Brunner

Metallization defect detection in 3D integrated components using acoustic microscopy and acoustic simulations

ESREF2018 (oral presentation)

R. Brunner

Advanced Non-Destructive Material & Failure Characterization in Microelectronics using Ultrasound

USE2018 (poster)

R. Brunner

Accretion Detection via Scanning Acoustic Microscopy in Microelectronic Components - Considering Symmetry Breaking Effects

M&M 2017 conference (oral presentation)

Maria-Louise Witthøft

Mobility and Carrier Concentration Measurements on nm-Wide Semiconductor Fins

 E-MRS spring 2018 (presentation)

Maria-Louise Witthøft

Precision of Micro Hall Effect Measurements in Scribe Line Test Pads of Boron doped SiGe

poster at “Frontiers of Characterization and Metrology for Nanoelectronics (FCMN)

Maria-Louise Witthøft

Micro Four-Point Probe Seebeck Measurements On nm-Wide Si Fins

poster at “Frontiers of Characterization and Metrology for Nanoelectronics (FCMN)

Steven Folkersma

Electrical characterization of single nanometer-wide Si fins in dense arrays

Presentation at E-MRS Fall 2017

Steven Folkersma

Correlative metrology of nanometer-wide B-implanted Si fins

Presentation at IIT 2018

Steven Folkersma

From Zero- to One-dimensional Electrical Characterization of Nanometer-wide Si Fins

Presentation at IIT 2018

Jean-Paul Barnes

 

Combining TOF-SIMS with X-ray nanotomography or AFM : fusion of morphological and hyperspectral datasets for nanoelectronic and energy applications.

SIMS XXI (presentation)

 

Maiglid Moreno

 

Combined ToF-SIMS and AFM protocol for accurate 3D chemical analysis and data visualization

AVS-65

 

Maiglid Moreno

 

Development of 3D high resolution imaging by the correlation of ToF-SIMS and AFM: application to GaAs based structures

79th. IUVSTA Workshop

 

 

Scientific publications

1st Author

Title

Date

Journal reference

DOI

Maria-Louise Witthøft

Precision of Micro Hall Effect Measurements in Scribe Line Test Pads

2017

linked to presentation at “Frontiers of Characterization and Metrology for Nanoelectronics (FCMN)

http://orbit.dtu.dk/files/127861119/abstract_FCMN_2017_Final_2.pdf

Janusz Bogdanowicz

Width-dependent sheet resistance of nanometer-wide Si fins as measured with micro four-point probe

2017

Physica Status Solidi C, vol 215 (6), 1700857

https://doi.org/10.1002/pssa.201700857

E. Kozic

Metallization defect detection in 3D integrated components using acoustic microscopy and acoustic simulations

2018

Microelectronics Reliability, vol 88-90, 262

https://doi.org/10.1016/j.microrel.2018.07.075

Roland Brunner

Advanced Ultrasound Characterization  in Microelectronics

2018

Proceeding from USE-2018

 

E. Grünwald

Simulation of Acoustic Wave propagation in Aluminium Coatings for Material Characterization

2017

Coatings, Vol 7(12), 230

https://doi.org/10.3390/coatings7120230

Eva Grünwald

Accretion Detection via Scanning Acoustic Microscopy in Microelectronic Components - Considering Symmetry Breaking Effects

2017

Volume 23, Supplement S1 (Proceedings of Microscopy & Microanalysis 2017) July 2017 , pp. 1466-1467

https://doi.org/10.1017/S1431927617007991

E. Kozic

Utrasonic methods for material and failure characterization

Defended 2018

PhD Thesis, Principal supervisor R. Brunner,

https://pure.unileoben.ac.at/portal/en/publications/ultrasonic-methods-for-material-and-failure-characterization(ea6f2f0c-3ba4-43df-a5d6-e10ce3471186).html?customType=theses

Valentina Spampinato

Nanoscaleelectrochemical response of lithium-ion cathodes: a combined study using C-AFMand SIMS

2018

 Beilstein J. Nanotechnol. Vol 9,1623–1628.

doi:10.3762/bjnano.9.154

A. Franquet

A flexible organic memory  device with a clearly disclosed resistive switching mechanism

2019

Organic Electronics 64,  209–215

10.1016/j.orgel.2018.10.018

Maria-Louise Witthøft

Mobility and Carrier Concentration Measurements on nm-Wide Semiconductor Fins

2018

Abstract submitted and accepted at E-MRS spring 2018

 

Maria-Louise Witthøft

Variable Probe Pitch Micro Hall Effect Method

2018

Beilstein Journal of Nanotechnology

https://www.beilstein-journals.org/bjnano/content/pdf/2190-4286-9-192.pdf?m=y

Maria-Louise Witthøft

Micro Four-Point Probe Seebeck Measurements On nm-Wide Si Fins

2-4 April 2019

Abstract for “Frontiers of Characterization and Metrology for Nanoelectronics (FCMN)

 

Steven Folkersma

Electrical characterization of single nanometer-wide Si fins in dense arrays

2018

Beilstein J. Nanotechnol. 2018, 9, 1863–1867

doi:10.3762/bjnano.9.178

Steven Folkersma

Towards Carrier Profiling in Nanometer-wide Si Fins with Micro Four-Point Probe

2018

Proceedings from IIT 2018

 

Steven Folkersma

Size Effects on Dopant Activation in Si Fins

2019

Abstract for “Frontiers of Characterization and Metrology for Nanoelectronics (FCMN)

 

J. Op de Beeck

Direct imaging and manipulation of ionic diffusion in mixed electronic-ionic conductors

2018

NANOSCALE 10 (26), 12564

10.1039/c8nr02887g

T. Conard

Inorganic material profiling using Ar-n(+) cluster: Can we achieve high quality profiles?

2018

Applied surface science, 444, 633

10.1016/j.apsusc.2018.02.159

Maiglid Moreno

Combined ToF-SIMS and AFM protocol for accurate 3D chemical analysis and data visualization

2018

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 36 (3) 1071

10.1116/1.5019464

Maria-Louise Witthøft

Hall effect measurement for precise sheet resistance and thickness evaluation of Ruthenium thin films using non-equidistant four-point probes

2018

AIP Advances 8 (5), 55206

10.1063/1.5010399

Sebastian Brand

Lock-In-Thermography, Photoemission, and Time-Resolved GHz Acoustic Microscopy Techniques for Nondestructive Defect Localization in TSV

2018

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 8(5), 735

10.1109/TCPMT.2018.2806991

F. Altmann

Failure Analysis Techniques for 3D Packages

2018

Proceedings of 2018 25TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA)

 

G. Ross

Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects

2017

APPLIED PHYSICS LETTERS 110 (5), 55102

10.1063/1.4975305

S. Brand

Acoustic and Photoacoustic inspection of Through-Silicon Vias in the GHz-frequency band

2017

ISTFA 2017: CONFERENCE PROCEEDINGS FROM THE 43RD INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, pp 95-102

 

N. Kaushik

Reversible hysteresis inversion in MoS2 field effect transistors

2017

NPJ 2D MATERIALS AND APPLICATIONS, 1, UNSP34

10.1038/s41699-017-0038-y

DMA Mackenzie

Quality assessment of graphene: Continuity, uniformity, and accuracy of mobility measurements

2017

NANO RESEARCH, 10(10), 3596

10.1007/s12274-017-1570-y

A. Khaled

Study of GHz-SAM sensitivity to delamination in BEOL layers

2017

MICROELECTRONICS RELIABILITY, 76, 238

10.1016/j.microrel.2017.06.075